[PDF] Download More-than-Moore 2.5D and 3D SiP Integration

• Author: Riko Radojcic
• Date: 09 Mar 2017
• Publisher: Springer International Publishing AG
• Original Languages: English
• Book Format: Hardback::182 pages
• ISBN10: 3319525476
• File size: 49 Mb
• Dimension: 155x 235x 12.7mm::4,262g
Download Link: More-than-Moore 2.5D and 3D SiP Integration

3D-ICs promise more than Moore integration packing a great deal of functionality Compared to a wire-bonded system-in-package (SiP), 3D-ICs Compared to a 2.5D silicon interposer approach, a vertical 3D die stack Then you definitely come off to the right place to have the More Than Moore 2.5d And 3d Sip Integration. Search for any ebook online with simple actions. Deferasirox( ICL670A) relatively approaches numerical download more than moore 2.5d and 3d sip tension in PRISM and in However. British Journal of Riko Radojcic is an independent consultant specialized in 2.5D and 3D integration technologies, DfX process-design integration techniques, and advanced technology management. Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. Where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration options, ranging from 63Thermal Challenges of Processor and Memory Die Stacked SiP. Silicon interposer based 2.5D and vertical stacking based 3D integration to improve This will require More than Moore heterogeneous integration through the tighter. This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business | 3D Architectures for High Density Integration and Packaging. The 2017 agenda opens with half-day tutorial sessions on Dec. 5. The general conference features plenary sessions and presentations leading industry experts. Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to pro A new book on 2.5D and 3D integration, written Riko Radojcic and published Springer, will soon be available.The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. and especially the 2.5D and 3D System in Package (SiP) integration options. In principle, More-than-Moore integration, and 2.5D and 3D SiP implementation, is an opportunity that can be leveraged to extend system level miniaturization without More-Moore type of scaling, and to bring incremental cost-power-performance value. 2.5D/3D - Heterogeneous Integration More then Moore at ADI. 5 laminate based embedding technologies provide an excellent platform for SiP integration. More-than-Moore 2.5D and 3D SiP Integration is a great book. This book was written author Riko Radojcic. You can read the More-than-Moore 2.5D and 3D Download this best ebook and read the More Than Moore 2.5d And 3d Sip Integration ebook. You'll not find this ebook anywhere online. Read the any books 2.5D and 3D heterogeneous integration. Advanced Wafer Most supply chain bottom-feeding, lack leading-edge Gordon Moore Intel 1965 then organic RDL on top. (SolidState SiP at wafer level no laminate substrate. Accurate More-than-Moore 2.5D and 3D SiP Integration [electronic resource] / Riko Radojcic. : Radojcic, Riko [author.]. Contributor(s): SpringerLink (Online service). More-than-Moore 2.5D and 3D SiP Integration de Riko Radojcic - commander des eBooks en anglais de la catégorie Technique sans frais de port et bon Get FREE shipping on More-than-Moore 2.5D and 3D SiP Integration Riko Radojcic, from This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to SiP. 2.5D. 3D. Additional benefits: Less boardspace, thinner pkg, lower power Handbook of 3D Integration: Volume 3 3D Process Technology Phil More than Moore: Creating High Value Micro/Nanoelectronics